Objectives: To evaluate the degree of polymerization and
flexural strength of five adhesives including Tokuyama Bond Force.
Methods: Tokuyama Bond Force (BF/Tokuyama
Dental), One-up Bond F Plus (OBFP/Tokuyama Dental), Optibond All-in-One
(OP/Kerr), Xeno IV (X4/Dentsply), Clearfil SE Bond (SE/Kuraray)
were used. The adhesives were placed into the mold (6 mm diameterx0.5 mm). The solvent was
removed by air blow. The residual ratio of the C=C absorption strength of
monomer before and after light irradiation was evaluated by FT-IR spectrometer
(Perkin Elmer Spectrum One). Three-point bending test was then performed and
flexural strength was calculated according to ISO 10477.
Results: Means (sd,
n=6) of degree of polymerization (%) and flexural strength (MPa) are summarized
in a table.
Conclusions: Bond Force showed relatively high degree
of polymerization and flexural strength even to SE Bond which is two-step adhesive.
Bonding Material | Degree of polymerization / % (sd) | Flexural Strength / MPa (sd) | BF | 67.2(2.3) | 105.2(3.1) | OBFP | 48.3(3.0) | 55.8(2.1) | OP | 49.3(1.9) | 41.2(3.2) | X4 | 40.5(0.9) | 43.3(2.4) |
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