Degree of polymerization and flexural strength of Tokuyama Bond Force

Objectives: To evaluate the degree of polymerization and flexural strength of five adhesives including Tokuyama Bond Force.

Methods: Tokuyama Bond Force (BF/Tokuyama Dental), One-up Bond F Plus (OBFP/Tokuyama Dental), Optibond All-in-One (OP/Kerr), Xeno IV (X4/Dentsply), Clearfil SE Bond (SE/Kuraray) were used. The adhesives were placed into the mold (6 mm diameterx0.5 mm). The solvent was removed by air blow. The residual ratio of the C=C absorption strength of monomer before and after light irradiation was evaluated by FT-IR spectrometer (Perkin Elmer Spectrum One). Three-point bending test was then performed and flexural strength was calculated according to ISO 10477.

Results: Means (sd, n=6) of degree of polymerization (%) and flexural strength (MPa) are summarized in a table.

Conclusions: Bond Force showed relatively high degree of polymerization and flexural strength even to SE Bond which is two-step adhesive.

Bonding Material	Degree of polymerization / % (sd)	Flexural Strength / MPa (sd)
BF	67.2(2.3)	105.2(3.1)
OBFP	48.3(3.0)	55.8(2.1)
OP	49.3(1.9)	41.2(3.2)
X4	40.5(0.9)	43.3(2.4)