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Microtensile Bond Strength of Self-Etch Adhesives with the Total-Etch Technique
T. HOHNSTEIN1, R. VANDEVELDE2, K. VANDEWALLE3, and J. LINDEMUTH1, 1USAF, Travis AFB, CA, USA, 2USAF, Wright Patterson AFB, OH, USA, 3USAF, Lackland AFB, TX, USA | Objective: To determine if the application of
35% phosphoric acid prior to the use of self-etching adhesives affects
microtensile bond strength of composite to dentin. Methods: The
coronal enamel of 25 extracted human molars was removed exposing dentin. The flattened
dentin was treated with Xeno IV (Dentsply) or iBond (Heraeus) with or without a
10-second phosphoric acid pre-etch and light cured with a quartz-tungsten-halogen curing light (Optilux 501, Kerr) for 10
seconds. All-Bond 2 (Bisco) was used as a control. Composite (Z-250,
3M/ESPE) was incrementally placed and cured to approximately 4 mm. The
specimens were sectioned into 1 x 1 mm beams (Isomet 5000,
Buehler). Five teeth were used per each of five groups and four beams were
sectioned from each tooth (n=20). The beams were separated in tension by a
universal testing machine (Instron Model 5543)
at a crosshead speed of 1 mm/min. A mean (MPa) and standard deviation
were determined per group. Results: A difference was found between
groups using a one-way ANOVA (p < 0.0001). Tukey Post-hoc test was used for
multiple comparisons. See Table below. A 2-way ANOVA was performed (excluding
AllBond 2) to examine the effects of bonding agent or etching on bond
strengths. A difference was found based on bonding agent (p < 0.0001) and
etchant use (p = 0.001). However, there was a significant interaction (p =
0.011). Separate T-Tests were performed comparing the etched vs. nonetched
groups of each bonding agent. There was a significant difference between the etched
and nonetched groups of Xeno IV (p = 0.0002) but not for iBond (p = 0.3). Conclusions:
The effect of pre-etching of dentin with phosphoric acid is product
specific. Xeno IV showed a dramatic improvement in microtensile bond strength,
however, iBond showed no difference.
Bonding Agent | MPa (st dev) | Xeno IV with etch | 47.7 (18.7) a | AllBond 2 (control) | 36.0 (16.7) a,b | iBond with etch | 25.8 (9.6) b,c | Xeno IV no etch | 25.5 (15.6) b,c | iBond no etch | 22.3 (11.4) c | Groups with same letter are not statistically different. (p > 0.05) |
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Seq #125 - Environment, Material, and Technique Impacts on Bond Strength 2:45 PM-3:45 PM, Friday, April 4, 2008 Hilton Anatole Hotel Trinity I - Exhibit Hall |
Back to the Dental Materials 1: Adhesion - Bond Strength Testing and Mechanisms Program
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